( Reaffirmed 2002 ) IS : 2628 (Part II ) - 1967 lizdim Standard SPECIFICATION FOR ROTARY WAFER SWITCHES ( LOW CURRENT RATING ) PART II ROTARY WAFER SWITCHES WITH CENTRAL MOUNTING Electromechanical Chnirma~2 BRIG B. M. CIIAKRAVARTI Members Central Electronics Engineering Research Institute ( CSIR ), Pilani &RI R. RAMACHANDRAN (AI&mate ) SQN LDR M. G. ACHUTHAN Directorate of Technical Development & Production ( Air ) ( Ministry of Defence ) SHRI A. V. RAJU ( Alternate ) All India Radio Merchants' Association ( AIRMA ), SHRI A. N. AHUJA Bombay SHRI V. J. BHATT ( Alternate ) ( Bombay ) SHRI D. N. CHAUDHURI ( Alternate ) ( Calcutta ) SHRI L. S. V. EASWAR ( Alternate) ( Madras ) DEF-x-~; DIRECTOR (AIR MATENaval Headquarters, New Delhi DR G.N. ACHA~YA STAFF OFFICER ELECTRICAL ENCG ( Material Radio ) ( Alternate ) National Test House, Calcutta SHRI B. P. GHOSH Director General of Civil Aviation. J.;ti;-`_,,.-.. _; SHRI K. N. GOPALAKRISHNAN Civil Aviation ( Ministry of Transport :t Aviation ) SHRI S. JALEEL HASAN Hylam Limited, Hyderabad SHRI S. S. C;ZRDMASTER ( Alternate ) Elektrogears Pvt Ltd, Calcutta SHRI R. R. JUNTA Bharat Electronics Ltd, Bangalore SHRI K. S. KELKAR SHRI K. GURURATA (Alternate ) SHRI S. D. KULKARN; . ' PhiIips India Ltd, CaIcutta SHRI A. D.4s GUPTA ( Alternate 1 Indian Telephone Industries Ltd, Bangatore SHRI H. J. MIRC:HANDANI SHRI S. D. P'ANI( Alfernatr ) :HANDAXl Mulchandani Electrical & Radio Industries ~.td &RIP. R. ?V~UL( Bombay SHRI V. RAMA R.40 Bhabha Atomic Research Centre, Bombay SHRI T. V. A. SUBRAMANIAN ( Alternate ) ( ConfinuedOR&age 2 ) Components for Electronic Equipment Committee, ETDC 37 &presenting Se&pal Directorate General of Research ( Ministry of Defence ) & Development INDIAN STANDARDS M,U+IAKBHAVAN, 9 MHAIXJR NEW DELHI INS,TITUTION SHAH WFAR MARC 110002 IS : 2628 ( Part II) - 1967 { Continudfrom page 1 ) Members SHRI C. L. SHARMA SHRI T.S. SVBRAMAN:AN Rejwcsenting MC. Engineering Co, New Delhi Posts and Telegraphs Board ( Department of Communications ) SHRI C. G. SUBRAMANYAN Research & Development Organisation, Directorate of Standardization ( Ministry of Defence ) SHRI P. M. SHANKARRAO (dltemate) SHRI K. N. TIWARI Directorate General of Inspection (Ministry of Defence ) SHRI S. K. MANX ( Alternate ) SHRI K. M. TOPRANI Telecommunication Industries Pvt Ltd, Bombay SHRI H. S. VISWESWARAIAH Radio & Electricals Manufacturing Co Ltd, Bangalore SHRI N. B. MANJANATHA RAO ( Alternate ) SHR~Y. S. VENK.~TESW.~R.~N, Director General, IS1 ( Ex-ofi& Member) Director ( Elec tech ) Secretary SHRI N. SRINWA~AN Deputy Director ( Elec tech), IS1 IS:26!28(PartII)-1967 Indian Standard SPECIFICATION FOR ROTARY WAFER SWITCHES ( LOW CURRENT RATING ) PARTII WITH ROTARY WAFER SWITCHES CENTRAL MOUNTING 0. FOREWORD Standard was adopted by the Indian Standards Institution on 2 March 1967, after the draft finalized by the Electromechanical Components for Electronic Equipment Sectional Committee had been approved by the Electrotechnical Division Council. 0.2 This standard which forms Part II of IS : 2628 covers the requirements for rotary wafer switches with central mounting, including the dimensional requirements. 0.3 This standard requires reference to IS : 2628( Part I )-1964* in which details of general requirements and tests have been fully covered. Only the relevant requirements and other special conditions have been included in this standard. 0.4 It is necessary in the case of components like rotary wafer switches to specify complete details including dimensions, design of indexing mechanisms, number of wafers, etc, so that the equipment designer may order and obtain his exact requirements. It is possible to have any number of types of switches to meet specified circuit requirements. This standard covers one such type and other parts laying down detailed specifications for other types of rotary wafer switches are to be issued in due course. 0.5 A series of Indian Standards on rotary wafer switches has been established with the object of specifying uniform requirements for the electrical, mechanical and climatic properties as well as safety aspects, test methods and dimensional details to ensure interchangeability and compatibility of rotary wafer switches generally used in electronic and telecommunication equipment. 0.6 Only dimensions required from the point of view of interchangeability have been standardized. Other indicated dimensions and contact arrangements in Fig. 1 or Fig. 2 which depend on individual circuit requirements, should be specified by the purchaser. requirements. 0.1 This Indian *Specification for rotary wafer switches ( low current rating ) : Part I Tests and general 3 IS : 2628 ( Part II ) - 1967 0.7 This standard is one of a. series of Indian components for electronic equipment. Standards on electromechanical 0.8 For the purpose of deciding whether a particular requirement of this standard is complied with, the final value, observed or calculated, expressing the result of a test, shall be rounded off in accordance with IS : Z-1960*. The number of significant places retained in the rounded off value should be the same as that of the specified value in this standard. 1. SCOPE 1.1 This standard ( Part II ) covers the requirements, including the dimen-` sional requirements, for rotary wafer switches ( low current rating ) with central mounting used in electronic and telecommunication equipment. 1.1.1 Rotary wafer switches with normal-duty mechanisms are covered in this specification. and NOTE- The terms `normal-duty' electric%1 rating of the switches but indicate 2. and heavy-duty indexi the ; ` heavy-duty' the difference bear no relationship to in the operating torque. TERMINOLOGY the definitions of terms given in 2 of 2.0 For the purposes of this standard, IS : 2628 (Part I)-1964t shall apply. 3. TYPE DESIGNATION 3.1 Rotary wafer switches conforming to this standard shall be designated by: a) the indication of type of switch, namely, Type 1 to indicate the switches having wafers of maximum size 50 mm conforming to Fig. 1, and Type 2 to indicate switches having wafers of maximum size 37 mm conforming to Fig. 2; b) the applicable climatic category; and c) the grade of the switch. 4. GRADES &I The provisions of 3.1 of IS : 2628 (Part I)-1964t 5. CLIMATIC shall apply. SEVERITIES shall apply. 5.1 The provisions of 3.2 of IS : 2628 (Part I)-1964t *Rula for rounding off numerical values ( revised j . $$eeit&tion for rotary wafer switches ( low current rating ) : Part I Tests and general requirements. 4 IS:2628(PartlI)-1967 60 PREFERRED 6.35 PERMISSIBLE 1 SCREEN(IF LINES TO REQUIRED BE MADE THESE DOTTEO FULL SOLID LINES 3 DIMENSIONS AND POSlT10NS4MAX OF LOCATING LUG. 4MAX WIDE l3.5 OR 9.5 RADRJS AT 1f INTERVAL FROM LINE A-A 3.5 #p, 2 HOLE NORMAL DUTY INDEX INDEX THROW MECHP rNISM 30?60' PARALLEL LOCATING CAN BE SUPPLIEO LUG IN 3.0 FOR SEALED SPINDLE SE;:CJJ 1 -4 29.LMAX!HEAVY DUTY INDEX INDEX THROW 9.5MAX-d cM fk$N'SM 38 I FRONT AND REAR OF SECTIONS VIEWED FROM END OF SWITCH IN EXTREME COUNTER-CLOCKWISE FRONT OR KNOB POSITION FORWARD INSULATED TERMINATION NOTES:OTHER INDICATED DIMENSIONS ARRANGEMENTS WHICH DEPEND CIRCUIT REOUIREMENTS, SHOULD BY THE PURCHASER i AND CONTACT ON INOIVIOUAL BE SPECIFIED ROTOR STRA:GHT STATOR REVERSE STATOR THROUGH INSULATED TERMINATION ROTOR FORWARD DUMMY TERMINATION INSULATE TERMINAllO CONNECTION TER CO ED T NO TERMINATION STRAIGHT ROTOR TERMINATION DRAW IN FLAT IF REOUIRED ON ABOVE SHAFT IN EXTREME COUNTER-CLOCKWISE POSITION AND SHOW ANGLE WITH REFERENCE TO LINE A-A FORWARD SHORTING STRAIGHT REVERSE STATOR ROTOR STATOR STATDR -FORWARD ROTOR TERMINATION SHORTING EDGE RAIGHT DUMMY TERMINATION REVERSE ROTOR TERMINATION PARALLELING ROTOR CONTACT NON-SHORTING ENLARGED DETAILS OF WAFER OF REPRESENTING THE AND TYPE OF TERMINATIONS OF ROTOR BLAOES WITH THE SWITCH IN EXTREME COUNTER-CLOCKWISE POSITION All dimensions FIG. 1 in millimetres. SWITCHES, SIZE 50 ROTARY WAFER 5 IS : 2628 ( Part II ) - 1967 6d PREFERRED 6.35 PERUISSIBL SCREEN(IF LINESTOBE REOUlRED THESE MADE FULL SOLID DOTTED / DIMENSIONS AND POSITIONS OF LOCATING LUG, I MAFi WIDE 9.5 RADIUS Al 13/' INTERVAL FROM LINE A-A -I JI~BMAX !- NORMAL OUTV INDEX MECHANISM INDEX THROW 30?60'= t FRONl ECTION 1 SECTION FRONT r. PARALLEL LOCATING SUPPLIED IN EITHER THESE POSITION(S) LUG OR CAN BE BOTH 5.0 FOR NON-SEALED SPINDLES 3.0 FOR SEALED SPINDLES SECR:I:: 5 SECTION REAR 6 4 HEAVY I-9.5mnx FRONT AND REAR OF SECTION VIEWED FROM END OF SWITCH IN EXTREME COUNTER-CLOCKWISE FRONT OR POSITION KNOB DUTY INDEX MECHANISM INDEX THROW 36/60* c3.2@.2HOLES I FORWARD "`"R~""~~~~~~~~:~~::;f~~l~~OR STRAIGHT INSULATED STATOR IERMINATION, REVERSE STATOR ROTOR FORWARD SHORTING STRAIGHT REVERSE THROUGH STATOR ROlOR STATOR STATOR TERMlNATlON INSULATED TERMINATION CONNECTION TERMlNAtlON COh!TACl EDGE 0 ROlOR NATION G EDGE STRAIGHT DUMMY TERMlNATlON REVERSE ROTOR TERMINATION PARALLELING ROTOR TERMINAlION TRAlGHl ROTOR TERMINATION dummv TERMINATION NOlES * NON-SHORTING L ENLARGED DETAILS OF AFER IN THE AND TYPE OF TERMINATIONS OF ROTOR BLADES WITH THE SWITCH EXTREME COUNTER-CLOCKWISE POSITION All dimensi FIG. 2 ROTARY w J in millimetres. ER % VITCHES, SIZE 37 6 IS:2628(PartII)-1967 6. DIMENSIONS -The rotary wafer switches shall conform to the dimensions specified in Fig. 1 or Fig. 2. Fig. 1 refers to rotary wafer switches of size 50 mm and Fig. 2 to rotary wafer switches of size 37 mm. SOTE Only dimensions required from the point Other indicated dimensions have been standardized. circuit requirements, should be specified by the purchaser. 6.1 Dimensions of view of interchangeability which depend on individual 7. MATERIALS, 7.1 The provisions 8. ELECTRICAL CONSTRUCTION of 5.1 of IS : 2628 AND WORKMANSHIP (Part I)-1964* shall apply. RATINGS combinations of voltage and current, and their associated circuit conditions under which the switch contact shall operate satisfactorily at standard atmospheric conditions are given in Table 1. TABLE CURRENT m.4 50 500 50 1 ELECTRICAL \IOLTAGE \' 3001 30/ 350 peak dc resistive circuit RATINGS CIRCUIT CONDITION 8.1 Recommended ac inductive circuit, power factor 0.7 to 0.8 and frequency f'==40to6oc/s a circuit whilst the NOTE current When these switches are not required to make or break is flowing, the current rating may be increased to 2A. 9. MARKING 9.1 The provisions of 6 of IS : 2628 (Part I)-1964*, 10. TEST SCHEDULE 10.1 General - This test schedule specifies all tests and the order in which they shall be carried out as well as the requirements to be met with. 10.2 Classification 1964* shall apply approval tests. *Specification requirements. shall apply. of Tests - The provisions of 13 of IS : 2628 ( Part I )except for the modifications specified in 10.2.1 for type wafer switches ( low current rating ) : Part 1 Tests and general for rotary 7 IS : 2628 ( Part II ) - 1967 10.2.1 Details of Samples - Three specimens of each category and grade shall have 6 or more wafers, the remainder need have only 2 wafers having a full set of contacts. The selected samples shall be representative of shorting and non-shorting contacts; double-sided wafers and eyelet insulators. 10.3 Conditions for 1964* shall apply. 10.4 Test Schedule - Tests - The provisions of 7 of IS : 2628 (Part I)- The test schedule shall be as specified in Table 2. NOTE 1 - The clause reference, conditions of tests and test requirements specified are applicable for the acceptance tests also and the grouping into lots, is for the purposes of the type tests only. NOTE 2 - Conditions of tests and values for the requirements that are to be specified according to IS : 2628 ( Part I )-1964* only are given in columns 4 to 6 of Table 2. Other conditions and requirements are according to IS : 2628 ( Part I )-1964*. 11. ORDER FORM 11.1 In the case of components like rotary wafer switches it is necessary for the purchaser to specify complete design details ( including dimensions, design of indexing mechanisms, number of wafers, etc, ) which affect their use and interchangeability and to specify means for identification of specific switches. 11.1.1 When ordering rotary wafer switches according to this standard the Fig. 1 and 2 in which are specified dimensions required for interchangeability, should be completed by the purchaser with respect to other dimensions as well as the contact arrangement. II.2 Contact Arrangement - The system indicated in Table 3 on P 19 is recommended for the contact arrangement for a single-, double-, threeand four-pole switches. Il.3 Dimensions - Tht blank dimensions in the figures shall be filled in considering the values for spacers, shield screening, etc, specified in 11.3.1 to 11.3.3, taking into account the appropriatespacing between and thickness of wafers where applicable. Where shield screenings are required the dotted lines shall be made into solid lines. Necessary details of spindle ends for fixing of knobs or for coupling shall be indicated as specified in Fig. 1 and 2. 11.3.1 S'acers mended. 11.3.2 lengths 1.5, 3, 6, 9.5, 12.5, 25 and 50 mm are recomThese shall be 1 mm thick. (low current rating) Shield Screening wafer *Specification requirements. switches : Part I Tests and general 8 IS : 2628 ( Pa&II 11.3.3 Minimum Spacing of Wafers as specified below: a) Mini&m ) - 1967 Minimum spacing of wafers shall be spacing between front plate and first section: 8 mm with terminations to rear of first section, and 9.5 mm with terminations facing front. b) Minimum spacing of section: 3.2 mm when terminations face away from each other, 8 mm when terminations face in same direction as adjoining sections, and 14.3 mm when terminations of both sections face towards each other. c) Minimum spacing between wafers and the screen: Terminations towards screen 9.5 mm, and Terminations away from screen 2.4 mm. 11.4 Other Details to be Specihd at the Time of Ordering purchaser shall furnish the details as given below while ordering: Sl No. Other Details to be Specijed at the Time of Ordering Item 9 ii) iii) `iv) v) vi) vii) : ir viii) ix) Category, Wafer contour Switch (wafer) grade Index mechanism Index throw No. of positions Total No. of wafer sections Spindle Bearing strap Sealed, Non-sealed Required, Not required 9 Delete words not required I, II, III Plain, Castehated Grade 1, Grade 2 Normal duty, Heavy duty 30°, 60" The Any Other Specia Requirements TABLE 2 TEST SCHEDULE* ( Clause 10.4 ) TEST C@U;;~F ( PAhT I )19647 CONDITIONS OF TENTS I Category I (4) TEST REQUIREMENTS .4 Category II (5) According to cl 6 and Fig. 1 and 2 10 rnQ, Max A 10 ma, Max 1 Category 12 (6) (1) All Samples Visual examination Dimensions Contact resistance (2) 8.1 8.2 9.1 (3) . 10 mQ, Max r Grade I Test voltage 500 f 50 v Grade II E; Insulation resistance 9.2 Insulation rcsistancc bctwecn parts specified in the following clauses of IS : 2628 ( Part I )-1964t 9.2.2 (a) 10 000 MO, 9.2.2 (b) 10 000 MQ, Min Min 1~80; Ma, 5 000 Ms2, Min Voltage proof 9.3 Test voltage 1 050 V (peak ) Grade I Grade II ' Capacitance 9.5 At 1 MC/S Capacitance between parts as spcciticd in the following clauses of IS : 2628 ( Part I)-1964 t 10 pF, MUX 10 9, 3, 10 >, 9, 10 Not'App&able Sealing, normal ( for sealed type only ) 11.9. 1 The rate of leakage shall not exceed 1 ml per hour. L JEe `I`hc switches shall then bc divided into live lots and all switches Appendix .1 of 1S : 26'8 ( Part 1 )-1964* J, in each lot shall undergo the tests spccificd for CX~ lot Rotational torque 10.1 For heavy duty types: 3 kgf.cm, ML~ 6.5 kgf.cm, Max For normal duty types: 1.5 kgf.cm, Min 45 kgf.cm, Max Torque 17 kgf.cm Heavy duty index mechanism: The switch shall fall into any contact a range of 12' from that position. Normal duty index mechanism: `I`he switch shall fall into any contact a range of 5' from that position. position when placed within End stop torque lndex mechanism 10.2 10.3 position when placed within E Robustness of terminations a) Tensile test b) Bending test Soldering 10.4 10.4.1 10.4.2 10.5 Load 1 kg 2 Bends hlethod 2 of 7.18 1s : 589-19611 Size of bit 8 mm Period of recovery minutes Scvcrity III of 30 1 of 1s \Xbration Contact rcsislancc after vibration 10.6 10.6.4 ( see Table : 589-1961s ) 10 mSZ, MUX *For sequence of type tests, see Appendix A of IS : 2628 ( Part I )-1964,. tSpecification for rotary wafer switches ( low current rating ) : Part I Tests and general $Basic climatic and mechanical durability tests for electronic components. requirements. ( Continued) TABLE 2 TEST C@uss2~ (R&I)1964* TEST SCHEDULE - Contd I Category I CONDITIONS OF TESTS TESTREQUIREMENTS A Category II Category 1';; (1) First Lot ( Confd) Bumping Contact resistance after bump test Rapid change of temperature ( applicable to category I and II only ) ;5 Contact resistance (2) 10.7 (3) (4) (5) (6) 10 ma, 11.8 Extreme temperatures of the appropriate temperature.range 10 mR, I Max 10 ma, Max lOmB, Max 11.8.4 Max 10 rnn, * Max -- Not cable appli- Grade Insulation tance resis11.8.4 Test voltage 5OOf5OV Insulation following 9.2.2 (a) 9.2.2 (b) Voltage proof 11.8.4 11.8.4 Test voltage 1050 V (peak I Grade II resistance between parts specified in the clauses of IS : 2628 ( Part I )-1964* 10 000 Mfi, Min 10 000 Ma, Min 1000 Ma, Min 5 000 Ma, Min ) Not less than 1.5 MB RF shunt resistance ( for grade I switches only ) Measured at 10 MC/S between two terminations not connected together r-Capacitance 11.8.4 At 1 MC/S *.I-___-_-_- Grade I Grade II Capacitance between parts as specified in the following clauses of IS : 2628 ( Part I )-1964* a) b) c) 4 e) 10 pF, Max 10 ,, 2, 10 ,, 33 10 ,, ,s Not applicable Rotational torque 11.8.4 For heavy duty types: For normal duty types : 3 kgfcm, Min f35 kgf.cm, Max 1.5 kgf.cm, Min 45 kgfcm, Mar Sealing, normal ( for sealed types only ) Dust t; Second Lot Climatic sequence Dry heat 11.9.1 11.12 ( Dust test is under consideration ) The rate of leakage shall not exceed 1 ml per hour 11 11.2 Maximum temperature category c Grade I -ph-pGrade II , Insulation resistance at high temperature 112.2 Test voltage: 500 f 5ov Insulation resistance between parts as specified in the following clauses of IS : 2628 ( Part I )-1964* 9.2.2 (a) 10 000 Mn, 9.2.2 (b) 10 000 Ma, Min Min 500 MO, Min 2 500 Ma, Min t: .. % ha h W Damp heat accelerated first cycle Cold 11.3 11.4 One cycle Minimum temperature category l;d x x Y *Specification for rotary wafer switches ( low current rating) : Part I Tests and general requirements. ( Continued ) I 5$ s TABLE TEST CLAUSE OF 2 TEST SCHEDULE - Conki TEST REQ~REMENTS tl & ii zi 00 h 2 x CONDITIONS OF TESTY IS : 2628 ( PART I )1964* r Category I Category II 7 Category III (1) Second Lot ( Contd ) Rotational torque at low temperature (2) 11.4.4 (3) For heavy duty types: For normal duty types: 3 kgfcm, A4in 8 kgf.cm, Aa.r 1.5 kgf.cm, Alin 6 kgfcm, Mm Grade I Capacitance 11.4.5 1 MC/S Capacitance between parts as specified in following clauses of IS : 26'28 ( Part 1 )- 1964* the Grade II 10 pF, hfax 10 ,, ,, ;; ,, ,, No;ippli&ble Radio frequency shunt resistance. Grade I ( for switches only ) Low air pressure Damp heat ( accelerated ) remaining cycles 11.4.6 Measured at 10 MC/S between two terminalions not connected together Not less than 1.5 h4n 11.5 11.6 Contact resistance 11.6.3 lo ma,Max 10 ma, Max 10 mQ, Max Grade I Insulation tance resis11.6.3 Test voltage : 500 f 50 V Insulation resistance between parts specified in the following clauses of IS : 2628 ( Part I )-1964* 9.2.2 (a) 10 000 hl,n 9.2.2 (bj 10 000 Ma, Voltage proof Radio frequency shunt resistance (for Grade I switches only ) 11.6.3 11.6.3 Test voltage 1 050 V ( peak ) Measured at 10 MC/S between two terminations not connected together c-`cI---Grade I Capacitance 11.6.3 Min Min Grade II 10 Ma, 1 000 h18, Min Min Not less than 1.5 Ma 1-___-_--7 Grade II At 1 MC/S Capacitance between parts as specified in the following clauses of IS : 2G28 ( Part I )-1964* g.; y;1 . . L Under consideration J Rotational torque ll.G.3 10 pF, Max 10 ,> ,, f; 3, :, X07 ble appi!lcaE .. W 0, 3 h Y - For heavy duty types: 3 kgf.cm, Min 6.5 kgf.cm, Max For normal duty types: 1.5 kgfxm, Min 4.5 kgf.cm, Max *Specification for rotary wafer switches ( low current rating ) : Part I Tests and general requirements. TABLE TEST CLAUSE ()P IS : 2621 3 ( PART I b 1964* 2 TEST SCHEDULE - Conid TEST REQUIREMENTS h \ CONDITIONS OF TESTS I Category I Category II Category III (1) Second (2) 6 (4) c---___--__~__---__--_ Grade I (5) (6) Lot ( Contd ) Grade II resisInsulation tance after 24 hours recovery 11.6.4 Insulation following resistance between parts specified in the clauses of IS : 2628 ( Part I )-1964* A4in Min 1 ml per hour 100 MQ, Min 9.2.2 (a) IO 000 MQ, 9.2.2 (b) 10 000 Ma, z Sealing normal ( for sealed type only ) Salt mist Visual tion 7hird Lot Damp term Contact heat, long 11.7 11.7.4 10 ma, C-Grade Insulation resistance 11.7.4 Test voltage 500 f 50 V Jnsulation following Max I examina11.9.1 11.10 8.1 Rate of leakage 1000 Ma,Min shall not exceed resistance 10 mQ, L Max 10 ma, --7 Grade Max II resistance between parts specified .in the clauses of IS : 2628 ( Part I )-1964* 10 MO, 100 Ma, Min Min Min 9.2.2 (a) 10 000 WK!, iWin 9.2.2 (b) 10 000 Ma, Voltage proof 11.7.4 Test voIta,oe ( peak 1 1 050 V Radio frequency shunt resistance (for Grade I switches only ) 11.7.4 hleasured at 10 MC/S between two terminations not connected together C--- Not less than 1.5 hIQ --.--- ~-._-_--~~ Grade I Capacitance 11.7.4 At 1 MC/S Capacitance between parts specified in the following clauses of IS : 2628 ( Part I )-1964* 9.52 9.5.2 9.5.2 9.5.2 9.5.2 Rotational torque 11.7.4 (a) (b) (c) Under consideration (d) i (e) J For heavy duty types: For normal duty types: Sealing normal ( for sealed type only ) Fourth Lot Endurance test 12 Number 10 000 of cycles 11.9.1 Grade II 10 pk, h&x 10 9, ,, 10 >, ,, 10 >, Not appiicable 3 kgf.cm, Min 6.5 kgf.cm, Max 1.5 kgf.cm, Min 4.5 kgf.cm, Max Rate of leakage shall not exceed 1 ml per hour a) Resistive circuit b) Inductive cuit *Specification cir- V = 30 V dc { I = 500 mA _f= 40 to 60 c/s Power factor = 0.7 to 0.8 i V=250V(rms) 1 I=50mA for rotary wafer switches (low current rating) : Part I Tests and general requirements. i Continued ) V TABLE 2 TEST TEST SCHEDULE I- Confd TEST REQUIREMENTS * , Category III IS : 2628 ( PART I )1964* CLAUSE OF CONDITIONS OF TESTS category I Category II (1) Fourth Lot ( Confd) Contact resistance Rotational torque (2) 12.5.3 12.5.3 20 rn0, Max 20 rnfi, Max For heavy duty types For normal duty types 20 mQ, Max : 3 kgf.cm, Min G.5 kgf.cm, Max : 1.5 kgf.cm, Min 4.5 kgf.cm, A4ax Voltage proof Radio frequency shunt resistance (for Grade I switches only ) `Corona Sealing normal (for switches sealed only ) Fzyth IAt extended Sealing ( for sealed switches only ) Mould growth 12.5.3 12.5.3 Test voltage 1 050 V ( peak ) Measured at 10 MC/S between two terminations not connected together Not less than 1.5 Ma 9.4 11.9.1 The rate of leakage shall not exceed 1 ml per hour 11.9.2 The rate of leakage shall not exceed 1 ml per hour 11.11 *Specification for rotary wafer switches ( low current rating) : Part I Tests and general requirements. IS : 2628 ( Part II ) - 1967 TABLE 3 RECO MMENDED CONTACT ARRANGEMENTS ( Clause 11.2 ) TERMINATION ON FRONTSIDE -1-.-L&_-_1 Pole- 2 Pole3 Pole11 Posi- 5 Posi3 Positions tions tions (2) R S S S S S S S S S S S (3) R S S S S S R S S S S S (4) R s's S S R S S S R S S S S R S S R, S S R S S TERMINATION ON REAR SIDE -, ,~--_-----_~_ \ 4 Pole- Number 1 Pole- 2 Pole- 3 Pole- 4 Pole2 Posiof Ter- 1'1 Posi- 5 Posi- 3 Posi- 2 Positions tions tions tions mination tions (5)' R (6) 1 2 3 4 5 6 (7) S S S S S S S S S S S R (8) S S s. S S R S S S S S R (9) S S s .R, S (10) S S R S S r-Number of Termination (1) 1 2 3 4 5 6 7 8 9 10 11 12 , s S R. S S S R `R R. S S R S S * 7 8 9 10 11 12 NOTE - Here `R' denotes rotor termination ( pole ), that is, a common termination which is capable of being connected internally to other terminations in turn+ by operation of the switch; and `S' denotes stater terminations ( position ), that is, that termination to which the rotor termination is capable of being connected during operation of the switch. 19